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  Deposition Etching Lithography Furnaces Packaging Cleaning CMP
• Process
  ALD Sputter Evaporation Parylene RIE DRIE Wet Etch Vapor Prime LPCVD Oxidation Diffusion Dicing Wirebonding Wafer Bonding Chemical Solvent Plasma CMP Positive Photoresist Lift-0ff Negative Photoresist PECVD
• Tool
  Cambridge Fiji F200 Denton Discovery 18 TMV Super Denton SJ20C CHA SEL600 SCS PDS-2010 Oxford Plasmalab 80 Oxford 100 ICP Etch Solution YES LP-III Canary 4 Canary 3 SiN Canary1 Canary 2 Disco DAD641 MEI Wedge EVG 520 IS Wet Bench Solvent Hood Spin Rinse Dryer Strasbaugh 6EC Thick Resist Thin Resist Multiple Oxford Plasmalab 80 Plus Denton 635
• Material
  HfO ZnO Pt SiO2 Al Cr Ti Au W ITO Ag C TiW Ir IrO Parylene SiN Si PR S1813 Descum N/A HMDS Poly-Si Amorphous Si 0/Low-Stress Nitride 1/Stoichiometric Nitride 2 4 Boron Phos Silicon Glass Cu Si-Metal-Si Si-Glass Polymer-Si-Polymer Si-Si RCA Piranha Acetone IPA Methanol diH2O Oxygen Plasma Al2O3 Expo HfO Expo ZnO Expo AZ 9260 LOR 10B Pre-deposition Post-deposition S1813 nLOF 2020 SU-8 2025 SiO2 (100C) SiO2 (300C) SiNx (100C) SiNx (300C) BB Bosch 9:5-15C 80:80 SF6-C4F8 BB Bosch 10:5-15C 80:80 SF6-C4F8 BB Bosch 11:5-15C 80:80 SF6-C4F8 BB Bosch 12:5-15C 80:80 SF6-C4F8 Ni NiFe 80:20 Ta YSZ