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  Cleaning CMP Deposition Dopant Transfer Etching Lithography LPCVD LTO LPCVD Nitride LPCVD Polysilicon Packaging Thermal Oxide Growth
• Process
  ALD Boron Doping Chemical CMP Dicing Doped Polysilicon DRIE Dry Oxides 30nm or Less Dry Oxides Greater than 30nm Evaporation Lift-0ff Low Stress Nitride LTO 400C 300mT Negative Photoresist NIT DEP 200MPa Parylene PECVD Phos Doping Plasma Positive Photoresist PSG 400C 300mT RIE Solvent Sputter Stoichiometric Nitride Undoped Polysilicon Vapor Prime Wafer Bonding Wet Etch Wet Oxidation Wirebonding
• Tool
  Cambridge Fiji F200 CHA SEL600 CLEANOX Denton 635 Denton Discovery 18 Denton SJ20C Disco DAD641 DOPED OX Etch Solution EVG 520 IS LTO Furnace MEI Wedge Multiple NITRIDE Furnace Oxford 100 ICP Oxford Plasmalab 80 Oxford Plasmalab 80 Plus POLY Furnace SCS PDS-2010 Solvent Hood Spin Rinse Dryer Strasbaugh 6EC Thick Resist Thin Resist TMV Super Wet Bench YES LP-III
• Material
  Acetone Ag Al Al (3 in) Al (4 in) Al2O3 Au Au (4 in) AZ 9260 BB Bosch 10:5-15C 80:80 SF6-C4F8 BB Bosch 11:5-15C 80:80 SF6-C4F8 BB Bosch 12:5-15C 80:80 SF6-C4F8 BB Bosch 9:5-15C 80:80 SF6-C4F8 C Cr Cr (4 in) Cu Cu (4 in) Descum diH2O Fe GeSbTe Glass H2O, O2, N2 HMDS IPA Ir Ir 10mT (3 in) Ir 15mT (3 in) Ir 5mT (3 in) IrO IrOx 10mT (3 in) IrOx 15mT (3 in) IrOx 5mT (3 in) ITO ITO (3") ITO (4") LOR 10B Methanol Mo Mo (3 in) N/A NbTi 50:50 Ni NiCr NiCr (4 in) NiFe 80:20 nLOF 2020 O2, N2 O2, N2, Boron Source Wafer O2, N2, Phosphorus Source Wafer Oxygen Plasma Parylene Piranha Plasma Al2O3 250C Plasma HfO2 200C Plasma SiO2 150C Plasma SiO2 200C Plasma TiO2 250C Polymer-Si-Polymer Post-deposition PR S1813 Pre-deposition Pt Pt (3 in) RCA S1813 Si Si-Glass Si-Metal-Si Si-Si SiCl2H2, NH3, N2 SiH4, N2 SiH4, O2 SiH4, O2, PH3 in SiH4 SiH4, PH3, N2 Silicon SiN SiNx (100C) SiNx (300C) SiO2 SiO2 (100C) SiO2 (3 in) SiO2 (300C) SU-8 2025 SU-8 3005 Ta Thermal Al203 100C Thermal Al203 200C Thermal Al203 250C Thermal HfO2 200C Thermal TiO2 250 C Ti Ti (3 in) TiW W W (3 in) YSZ